Publication:
Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks
| dc.contributor.author | Chang, Xinyue | |
| dc.contributor.author | Vermeersch, Bjorn | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Park, Seongho | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Chang, Xinyue | |
| dc.contributor.imecauthor | Vermeersch, Bjorn | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Park, Seongho | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | Chang, Xinyue::0000-0003-1875-6132 | |
| dc.contributor.orcidimec | Vermeersch, Bjorn::0000-0001-8640-672X | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Lofrano, Melina::0000-0002-3930-6459 | |
| dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
| dc.contributor.orcidimec | Park, Seongho::0000-0002-1058-9424 | |
| dc.contributor.orcidimec | Tokei, Zsolt::0000-0003-3545-3424 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2025-09-03T04:00:19Z | |
| dc.date.available | 2025-09-03T04:00:19Z | |
| dc.date.issued | 2025-AUG | |
| dc.description.wosFundingText | This work was supported as part of the IMEC Industrial Affiliation Program on Nano-Interconnect and has been strongly supported by the IMEC partners and the IMEC Reliability, Electrical testing, Modeling, and Nano-IC teams. | |
| dc.identifier.doi | 10.1109/tcpmt.2025.3564833 | |
| dc.identifier.doi | 10.1109/TCPMT.2025.3564833 | |
| dc.identifier.issn | 2156-3950 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/46145 | |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
| dc.source.beginpage | 1708 | |
| dc.source.endpage | 1716 | |
| dc.source.issue | 8 | |
| dc.source.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | |
| dc.source.numberofpages | 9 | |
| dc.source.volume | 15 | |
| dc.subject.keywords | CONDUCTIVITY | |
| dc.title | Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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