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Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks

 
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dc.contributor.authorChang, Xinyue
dc.contributor.authorVermeersch, Bjorn
dc.contributor.authorOprins, Herman
dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorChang, Xinyue
dc.contributor.imecauthorVermeersch, Bjorn
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecChang, Xinyue::0000-0003-1875-6132
dc.contributor.orcidimecVermeersch, Bjorn::0000-0001-8640-672X
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecLofrano, Melina::0000-0002-3930-6459
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecPark, Seongho::0000-0002-1058-9424
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2025-09-03T04:00:19Z
dc.date.available2025-09-03T04:00:19Z
dc.date.issued2025
dc.description.abstractIn this article, we introduce a modular thermal modeling methodology, BTE-FEM, that combines the Boltzmann transport equation (BTE) with finite element modeling (FEM) for simulations of advanced back-end-of-line (BEOL) stacks with high accuracy and efficiency. BTE-FEM is validated against direct BTE-based simulations using simplified BEOL stack test cases across various technology nodes and via connectivity configurations. It is demonstrated that conventional FEM, using bulk material properties, increasingly underestimates the BEOL thermal resistance as the technology node scales. In contrast, the BTE-FEM developed in this study demonstrates good agreement with direct BTE simulations for all test cases, but at much shorter runtimes. The impact of material properties, metal densities, and boundary conditions on the derived BEOL thermal properties are benchmarked and the developed models are experimentally validated at two distinct technology nodes. Finally, the developed methodology is applied to a 12-layer, 18 nm metal pitch BEOL stack from an A10 high density core design, demonstrating its ability to simulate complex and realistic BEOL routings with the precision of direct BTE simulations while substantially reduced simulation time. This approach enables extensive design of experiments (DOEs) for fast turnaround design iterations.
dc.description.wosFundingTextThis work was supported as part of the IMEC Industrial Affiliation Program on Nano-Interconnect and has been strongly supported by the IMEC partners and the IMEC Reliability, Electrical testing, Modeling, and Nano-IC teams.
dc.identifier.doi10.1109/tcpmt.2025.3564833
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/46145
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1708
dc.source.endpage1716
dc.source.issue8
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages9
dc.source.volume15
dc.subject.keywordsCONDUCTIVITY
dc.title

Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks

dc.typeJournal article
dspace.entity.typePublication
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