Publication:
Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks
| dc.contributor.author | Chang, Xinyue | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Vermeersch, Bjorn | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Park, Seongho | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Chang, Xinyue | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Vermeersch, Bjorn | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Park, Seongho | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | Chang, Xinyue::0000-0003-1875-6132 | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Vermeersch, Bjorn::0000-0001-8640-672X | |
| dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
| dc.contributor.orcidimec | Lofrano, Melina::0000-0002-3930-6459 | |
| dc.contributor.orcidimec | Tokei, Zsolt::0000-0003-3545-3424 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Park, Seongho::0000-0002-1058-9424 | |
| dc.date.accessioned | 2025-04-10T15:17:22Z | |
| dc.date.available | 2024-12-07T16:57:01Z | |
| dc.date.available | 2025-04-10T15:17:22Z | |
| dc.date.issued | 2024 | |
| dc.description.wosFundingText | This work was supported as part of the imec Industrial Affiliation Program on Nano-Interconnect and has been strongly supported by the imec partners and the imec Design-Technology Co-Optimization program. | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00084 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44934 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 498 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 505 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 8 | |
| dc.subject.keywords | INTERCONNECT | |
| dc.title | Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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