Publication:

Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits

Date

2011
Proceedings Paper
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dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVandepitte, Dirk
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-19T14:29:33Z
dc.date.available2021-10-19T14:29:33Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19111
dc.source.conferenceElectronics Packaging Technology Conference - EPTC
dc.source.conferencedate7/12/2011
dc.source.conferencelocationSingapore Singapore
dc.title

Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits

dc.typeProceedings paper
dspace.entity.typePublication
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