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Conference contributions
Impact of via geometry and line extension on via-electromigration in nano-interconnects
Publication:
Impact of via geometry and line extension on via-electromigration in nano-interconnects
Date
2023
Proceedings Paper
https://doi.org/10.1109/IRPS48203.2023.10118027
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Saleh, Ahmed
;
Zahedmanesh, Houman
;
Ceric, H.
;
De Wolf, Ingrid
;
Croes, Kristof
Journal
N/A
Abstract
Description
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787
since deposited on 2023-07-15
Acq. date: 2025-10-25
Citations
Metrics
Views
787
since deposited on 2023-07-15
Acq. date: 2025-10-25
Citations