Publication:
Methodologies for Characterization of W2W Bonding Strength
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Vanstreels, Kris | |
| dc.contributor.author | Okudur, Oguzhan Orkut | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Vanstreels, Kris | |
| dc.contributor.imecauthor | Okudur, Oguzhan Orkut | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
| dc.contributor.orcidimec | Okudur, Oguzhan Orkut::0000-0002-4790-7772 | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-04-10T15:09:00Z | |
| dc.date.available | 2024-12-07T16:57:34Z | |
| dc.date.available | 2025-04-10T15:09:00Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00129 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44949 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 790 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 797 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 8 | |
| dc.title | Methodologies for Characterization of W2W Bonding Strength | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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