Publication:

Guest Editors' Introduction: Special Issue on Design and Test of Multidie Packages

Date

2022
Editorial Material
https://doi.org/10.1109/MDAT.2022.3192358
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dc.contributor.authorCron, Adam
dc.contributor.authorJiao, Hailong
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.accessioned2022-12-22T15:43:19Z
dc.date.available2022-09-16T02:49:57Z
dc.date.available2022-12-22T15:43:19Z
dc.date.issued2022
dc.identifier.doi10.1109/MDAT.2022.3192358
dc.identifier.issn2168-2356
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40433
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage5
dc.source.endpage6
dc.source.issue5
dc.source.journalIEEE DESIGN & TEST
dc.source.numberofpages2
dc.source.volume39
dc.title

Guest Editors' Introduction: Special Issue on Design and Test of Multidie Packages

dc.typeEditorial material
dspace.entity.typePublication
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