Publication:

Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

Date

2023
Journal article
https://doi.org/10.1038/s41598-023-43887-0
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dc.contributor.authorVan Messem, Laura
dc.contributor.authorSinha, Siddhartha
dc.contributor.authorOcket, Ilja
dc.contributor.authorTrischler, Heinrich
dc.contributor.authorSchlaffer, Erich
dc.contributor.authorSchlick, Daniel
dc.contributor.authorRogier, Hendrik
dc.contributor.authorLemey, Sam
dc.contributor.imecauthorSinha, Siddhartha
dc.contributor.imecauthorOcket, Ilja
dc.contributor.orcidimecSinha, Siddhartha::0000-0003-4025-2854
dc.contributor.orcidimecOcket, Ilja::0000-0002-1503-7397
dc.date.accessioned2023-12-18T10:47:28Z
dc.date.available2023-11-12T17:45:47Z
dc.date.available2023-12-18T10:47:28Z
dc.date.embargo2023-10-04
dc.date.issued2023
dc.description.wosFundingTextThis work was made possible by AT &S, manufacturer for high-end printed circuit boards. Special thanks to Luc Pauwels and Nele Van Hoovels for providing their expertise during the measurements and to Francesco Filice and Andy Dewilde for the aid during the measurement time. I would like to express my gratitude to Olivier Caytan for proof reading this document.
dc.identifier.doi10.1038/s41598-023-43887-0
dc.identifier.issn2045-2322
dc.identifier.pmidMEDLINE:37794099
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43141
dc.publisherNATURE PORTFOLIO
dc.source.beginpageArt. 16714
dc.source.endpagena
dc.source.issue1
dc.source.journalSCIENTIFIC REPORTS
dc.source.numberofpages13
dc.source.volume13
dc.subject.keywordsWAVE-GUIDE
dc.subject.keywordsMICROSTRIP LINE
dc.subject.keywordsANTENNA
dc.subject.keywordsDESIGN
dc.subject.keywordsARRAY
dc.subject.keywordsCOMMUNICATION
dc.subject.keywordsTRANSITION
dc.subject.keywordsPOLYMERS
dc.subject.keywordsPCB
dc.title

Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

dc.typeJournal article
dspace.entity.typePublication
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