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Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Publication:
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandooren, Anne
;
Wu, Zhicheng
;
Khaled, Ahmad
;
Franco, Jacopo
;
Parvais, Bertrand
;
Li, W.
;
Witters, Liesbeth
;
Walke, Amey
;
Peng, Lan
;
Rassoul, Nouredine
;
Matagne, Philippe
;
Jamieson, Geraldine
;
Inoue, Fumihiro
;
Nguyen, B.Y.
;
Debruyn, Haroen
;
Devriendt, Katia
;
Teugels, Lieve
;
Heylen, Nancy
;
Vecchio, Emma
;
Zheng, T.
;
Radisic, Dunja
;
Rosseel, Erik
;
Vanherle, Wendy
;
Hikavyy, Andriy
;
Chan, BT
;
Besnard, G.
;
Schwarzenbach, W.
;
Gaudin, G.
;
Radu, Iuliana
;
Waldron, Niamh
;
De Heyn, Vincent
;
Demuynck, Steven
;
Boemmels, Juergen
;
Ryckaert, Julien
;
Collaert, Nadine
;
Mocuta, Dan
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2136
since deposited on 2021-10-27
Acq. date: 2025-10-23
Citations
Metrics
Views
2136
since deposited on 2021-10-27
Acq. date: 2025-10-23
Citations