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  4. Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
 
Publication:

Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications

Date

2019
Proceedings Paper
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Author(s)

Vandooren, Anne  
;
Wu, Zhicheng  
;
Khaled, Ahmad  
;
Franco, Jacopo  
;
Parvais, Bertrand  
;
Li, W.
;
Witters, Liesbeth  
;
Walke, Amey  
;
Peng, Lan  
;
Rassoul, Nouredine  
;
Matagne, Philippe  
;
Jamieson, Geraldine  
;
Inoue, Fumihiro  
;
Nguyen, B.Y.
;
Debruyn, Haroen  
;
Devriendt, Katia  
;
Teugels, Lieve  
;
Heylen, Nancy  
;
Vecchio, Emma  
;
Zheng, T.
;
Radisic, Dunja  
;
Rosseel, Erik  
;
Vanherle, Wendy  
;
Hikavyy, Andriy  
;
Chan, BT  
;
Besnard, G.
;
Schwarzenbach, W.
;
Gaudin, G.
;
Radu, Iuliana  
;
Waldron, Niamh  
;
De Heyn, Vincent  
;
Demuynck, Steven  
;
Boemmels, Juergen  
;
Ryckaert, Julien  
;
Collaert, Nadine  
;
Mocuta, Dan

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2136 since deposited on 2021-10-27
Acq. date: 2025-10-23

Citations

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2136 since deposited on 2021-10-27
Acq. date: 2025-10-23

Citations

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