Publication:

Wafer bonding and heterogeneous integration: III-V/silicon photonics

Date

2008-06
Proceedings Paper
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dc.contributor.authorRoelkens, Gunther
dc.contributor.authorLiu, Liu
dc.contributor.authorBrouckaert, Joost
dc.contributor.authorVan Campenhout, J.
dc.contributor.authorVan Laere, Frederik
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorBaets, Roel
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.date.accessioned2021-10-17T10:10:26Z
dc.date.available2021-10-17T10:10:26Z
dc.date.embargo9999-12-31
dc.date.issued2008-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14373
dc.source.beginpage87
dc.source.conference14th European Conference on Integrated Optics - ECIO
dc.source.conferencedate11/06/2008
dc.source.conferencelocationEindhoven the Netherlands
dc.source.endpage90
dc.title

Wafer bonding and heterogeneous integration: III-V/silicon photonics

dc.typeProceedings paper
dspace.entity.typePublication
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