Publication:
Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints
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1847 since deposited on 2021-10-15
Acq. date: 2025-12-15
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Metrics
Views
1847 since deposited on 2021-10-15
Acq. date: 2025-12-15
Citations