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Smart Diagnostics for 3D CFET: A Machine Learning Approach to Failure Analysis

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-7422-079X
cris.virtual.orcid0000-0001-5490-0416
cris.virtual.orcid0000-0002-6155-9030
cris.virtual.orcid0000-0002-9148-9037
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department821dc741-8843-4d53-8e1d-6f543228a740
cris.virtualsource.department9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.department3e40650e-6912-4bdd-adab-313461ddae1c
cris.virtualsource.departmentdde8f49e-2c4c-410c-989c-a288b3175847
cris.virtualsource.departmentce597ec5-f3fe-4966-abe1-6be960eae362
cris.virtualsource.orcid821dc741-8843-4d53-8e1d-6f543228a740
cris.virtualsource.orcid9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.orcid3e40650e-6912-4bdd-adab-313461ddae1c
cris.virtualsource.orciddde8f49e-2c4c-410c-989c-a288b3175847
cris.virtualsource.orcidce597ec5-f3fe-4966-abe1-6be960eae362
dc.contributor.authorMitard, Jerome
dc.contributor.authorKocak, Husnu Murat
dc.contributor.authorChiarella, Thomas
dc.contributor.authorSheng, Cassie
dc.contributor.authorDemuynck, Steven
dc.contributor.authorHoriguchi, Naoto
dc.date.accessioned2026-03-16T14:32:35Z
dc.date.available2026-03-16T14:32:35Z
dc.date.createdwos2025-11-11
dc.date.issued2025
dc.description.abstractThis work introduces a novel Convolutional Neural Network for classifying transfer characteristics in emerging Gate-All-Around MOSFET. Trained on vast experimental dataset, the algorithm successfully identifies distinct failure modes across wafers with complex processing variations. The automated analysis enables faster yield enhancement and process optimization for next-generation 3D MOSFET technologies.
dc.description.wosFundingTextThis work has been enabled in part by the NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union's Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania. For more information, visit nanoic-project.eu. We would like to thank more particularly the AMSIMEC team owning the electrical characterization labs in imec.
dc.identifier.doi10.1109/icmts63811.2025.11068926
dc.identifier.isbn979-8-3315-3170-6
dc.identifier.issn1071-9032
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/58845
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.beginpage143
dc.source.conferenceIEEE 37th International Conference on Microelectronic Test Structures (ICMTS)
dc.source.conferencedate2025-03-24
dc.source.conferencelocationSan Antonio
dc.source.endpage146
dc.source.journal2025 IEEE 37TH INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, ICMTS
dc.source.numberofpages4
dc.title

Smart Diagnostics for 3D CFET: A Machine Learning Approach to Failure Analysis

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-11-20
imec.internal.sourcecrawler
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