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Roles of additives during filling process of damascene structures with electrochemical deposited copper
Publication:
Roles of additives during filling process of damascene structures with electrochemical deposited copper
Date
2000
Proceedings Paper
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Richard, Emmanuel
;
Vervoort, Iwan
;
Brongersma, Sywert
;
Bender, Hugo
;
Beyer, Gerald
;
Palmans, Roger
;
Lagrange, Sébastien
;
Maex, Karen
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1928
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1928
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations