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Conference contributions
Controlling scratching in Cu chemical-mechanical planarization (CuCMP)
Publication:
Controlling scratching in Cu chemical-mechanical planarization (CuCMP)
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Date
2008
Proceedings Paper
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17489.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Eusner, T
;
Saka, N
;
Chun, Jung-Hoon
;
Armini, Silvia
;
Moinpour, M
;
Fisher, P. J.
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Abstract
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1865
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations
Metrics
Views
1865
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations