Publication:

Microvia-filling by copper electroplating

Date

2007
Presentation
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dc.contributor.authorLuhn, Ole
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.date.accessioned2021-10-16T17:41:31Z
dc.date.available2021-10-16T17:41:31Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12524
dc.source.conferenceEurointerfinish
dc.source.conferencedate18/10/2007
dc.source.conferencelocationAthens Greece
dc.title

Microvia-filling by copper electroplating

dc.typeOral presentation
dspace.entity.typePublication
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