Publication:
Wafer thinning and planarization tech-nology for 3D Interconnects
Date
| dc.contributor.author | Vaes, Jan | |
| dc.contributor.author | Cotrin Teixeira, Ricardo | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.date.accessioned | 2021-10-17T11:29:35Z | |
| dc.date.available | 2021-10-17T11:29:35Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14591 | |
| dc.source.conference | 13th International C.M.P. Planarization for ULSI Multilevel Interconnection Conference - CMP-MIC | |
| dc.source.conferencedate | 3/03/2008 | |
| dc.source.conferencelocation | Fremont, CA USA | |
| dc.title | Wafer thinning and planarization tech-nology for 3D Interconnects | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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