Publication:
Present and future technologies and applications of thin-film circuitry on flexible substrates
Date
| dc.contributor.author | Heremans, Paul | |
| dc.contributor.imecauthor | Heremans, Paul | |
| dc.contributor.orcidimec | Heremans, Paul::0000-0003-2151-1718 | |
| dc.date.accessioned | 2021-10-24T05:35:44Z | |
| dc.date.available | 2021-10-24T05:35:44Z | |
| dc.date.issued | 2017 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/28484 | |
| dc.source.conference | International Conference on Flexible and Printed Electronics - ICFPE | |
| dc.source.conferencedate | 5/09/2017 | |
| dc.source.conferencelocation | Jeju Korea | |
| dc.title | Present and future technologies and applications of thin-film circuitry on flexible substrates | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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