Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions

dc.contributor.author	Wu, Wen
dc.contributor.author	Brongersma, Sywert
dc.contributor.author	Van Hove, Marleen
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Brongersma, Sywert
dc.contributor.imecauthor	Maex, Karen
dc.contributor.orcidimec	Brongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned	2021-10-15T18:01:29Z
dc.date.available	2021-10-15T18:01:29Z
dc.date.issued	2004
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/9937
dc.source.beginpage	2838
dc.source.endpage	2840
dc.source.issue	15
dc.source.journal	Applied Physics Letters
dc.source.volume	84
dc.title	Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
dc.type	Journal article
dspace.entity.type	Publication
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