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Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures

Date

2000
Presentation
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dc.contributor.authorDonaton, R. A.
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorPollentier, Ivan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorGrillaert, Joost
dc.contributor.authorFyen, Wim
dc.contributor.authorBeyer, Gerald
dc.contributor.authorStucchi, Michele
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorDe Roest, David
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorPollentier, Ivan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecPollentier, Ivan::0000-0002-4266-6500
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-14T12:55:17Z
dc.date.available2021-10-14T12:55:17Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4344
dc.source.conferenceMaterials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.
dc.source.conferencelocation
dc.title

Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures

dc.typeOral presentation
dspace.entity.typePublication
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