Publication:
Modeling and experimental characterization of hot spot dissipation in 3D stacks
Date
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.date.accessioned | 2021-10-20T14:06:15Z | |
| dc.date.available | 2021-10-20T14:06:15Z | |
| dc.date.issued | 2012-06 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21233 | |
| dc.identifier.url | http://s3.electronics-cooling.com/issues/ECM_June2012.pdf | |
| dc.source.beginpage | 18 | |
| dc.source.endpage | 23 | |
| dc.source.issue | 2 | |
| dc.source.journal | Electronics Cooling | |
| dc.source.volume | 18 | |
| dc.title | Modeling and experimental characterization of hot spot dissipation in 3D stacks | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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