Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint

dc.contributor.author	Salenbien, R.
dc.contributor.author	Cote, R.
dc.contributor.author	Goossens, J.
dc.contributor.author	Limaye, Paresh
dc.contributor.author	Labie, Riet
dc.contributor.author	Glorieux, C.
dc.contributor.imecauthor	Labie, Riet
dc.contributor.orcidimec	Labie, Riet::0000-0002-1401-1291
dc.date.accessioned	2021-10-19T18:21:59Z
dc.date.available	2021-10-19T18:21:59Z
dc.date.issued	2011
dc.identifier.issn	0021-8979
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/19719
dc.source.beginpage	93101
dc.source.issue	9
dc.source.journal	Journal of Applied Physics
dc.source.volume	109
dc.title	Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint
dc.type	Journal article
dspace.entity.type	Publication
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