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Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects

Date

2020
Proceedings Paper
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dc.contributor.authorWu, C.
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorDemuynck, Steven
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorWu, C.
dc.contributor.imecauthorChasin, A.
dc.contributor.imecauthorDemuynck, S.
dc.contributor.imecauthorHoriguchi, N.
dc.contributor.imecauthorCroes, K.
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-11-25T10:05:37Z
dc.date.available2021-11-02T16:05:16Z
dc.date.available2021-11-24T09:01:30Z
dc.date.available2021-11-25T10:05:37Z
dc.date.issued2020
dc.identifier.eisbn978-1-7281-3199-3
dc.identifier.issn1541-7026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38205
dc.publisherIEEE
dc.source.conferenceIEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateAPR 28-MAY 30, 2020
dc.source.conferencelocationDallas, TX, USA
dc.source.journalna
dc.source.numberofpages6
dc.title

Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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