Publication:

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00102
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Author(s)

Derakhshandeh, Jaber  
;
Capuz, Giovanni  
;
Cherman, Vladimir  
;
Inoue, Fumihiro  
;
De Preter, Inge  
;
Hou, Lin  
;
Bex, Pieter  
;
Gerets, Carine  
;
Duval, Fabrice  
;
Webers, Tomas  
;
Bertheau, Julien  
;
Van Huylenbroeck, Stefaan  
;
Phommahaxay, Alain  
;
Shafahian, Ehsan  
;
Van der Plas, Geert  
;
Beyne, Eric  
;
Miller, Andy  
;
Beyer, Gerald  

Journal

na

Abstract

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2032 since deposited on 2021-11-02
Acq. date: 2025-10-23

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2032 since deposited on 2021-11-02
Acq. date: 2025-10-23

Citations