Publication:

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00102

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Author(s)

Derakhshandeh, Jaber

;

Capuz, Giovanni

;

Cherman, Vladimir

;

Inoue, Fumihiro

;

De Preter, Inge

;

;

;

;

;

;

Bertheau, Julien

;

Van Huylenbroeck, Stefaan

;

Phommahaxay, Alain

;

Shafahian, Ehsan

;

Van der Plas, Geert

;

;

;

Journal

na

Metrics

2037 since deposited on 2021-11-02

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Acq. date: 2026-01-07