Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics

dc.contributor.author	Madadnia, Behnam
dc.contributor.author	Vanfleteren, Jan
dc.contributor.author	Bossuyt, Frederick
dc.contributor.imecauthor	Madadnia, Behnam
dc.contributor.imecauthor	Bossuyt, Frederick
dc.contributor.imecauthor	Vanfleteren, Jan
dc.contributor.orcidimec	Bossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimec	Vanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned	2024-02-14T10:16:30Z
dc.date.available	2024-01-11T17:16:19Z
dc.date.available	2024-02-14T10:16:30Z
dc.date.embargo	2023-12-31
dc.date.issued	2023
dc.description.wosFundingText	No Statement Available
dc.identifier.doi	10.3390/mi14122248
dc.identifier.issn	2072-666X
dc.identifier.pmid	MEDLINE:38138416
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/43386
dc.publisher	MDPI
dc.source.beginpage	Art. 2248
dc.source.endpage	N/A
dc.source.issue	12
dc.source.journal	MICROMACHINES
dc.source.numberofpages	21
dc.source.volume	14
dc.title	Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics
dc.type	Journal article
dspace.entity.type	Publication
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