Publication:

Contact module at dense gate pitch technology challenges

Date

 
dc.contributor.authorDemuynck, Steven
dc.contributor.authorMao, Ming
dc.contributor.authorKunnen, Eddy
dc.contributor.authorVersluijs, Janko
dc.contributor.authorCroes, Kristof
dc.contributor.authorWu, Chen
dc.contributor.authorSchaekers, Marc
dc.contributor.authorPeter, Antony
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorTeugels, Lieve
dc.contributor.authorBoemmels, Juergen
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorMao, Ming
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorPeter, Antony
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.date.accessioned2021-10-22T01:13:36Z
dc.date.available2021-10-22T01:13:36Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23747
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6831894
dc.source.beginpage307
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage310
dc.title

Contact module at dense gate pitch technology challenges

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections: