Publication:
How significant will be the test cost share for 3D die-to-wafer stacked ICs?
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-19T19:31:23Z | |
| dc.date.available | 2021-10-19T19:31:23Z | |
| dc.date.issued | 2011-04 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19869 | |
| dc.identifier.url | http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5941432 | |
| dc.source.conference | IEEE 6th International Conference on Design & Technology of Integrated Systems in Nanoscale Era - DTIS | |
| dc.source.conferencedate | 6/04/2011 | |
| dc.source.conferencelocation | Athens Greece | |
| dc.title | How significant will be the test cost share for 3D die-to-wafer stacked ICs? | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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