Publication:
An efficient bump pad design to mitigate the flip chip package induced stress
Date
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T19:27:07Z | |
| dc.date.available | 2021-10-22T19:27:07Z | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25324 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | InterPACK & ICNNM | |
| dc.source.conferencedate | 6/07/2015 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | 7 | |
| dc.title | An efficient bump pad design to mitigate the flip chip package induced stress | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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