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Feasibility of TiSi2 and CoSi2 for sub quarter micron processes: problems of the etch selectivity

Date

1997
Proceedings Paper
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dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-09-30T07:55:36Z
dc.date.available2021-09-30T07:55:36Z
dc.date.embargo9999-12-31
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1717
dc.source.beginpage199
dc.source.conferenceAdvanced Metallization and Interconnect Systems for ULSI Applications in 1996
dc.source.conferencedate1/10/1996
dc.source.conferencelocationBoston, MA USA
dc.source.endpage203
dc.title

Feasibility of TiSi2 and CoSi2 for sub quarter micron processes: problems of the etch selectivity

dc.typeProceedings paper
dspace.entity.typePublication
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