Publication:

Liquid mediated direct bonding and bond propagation

Date

2016
Proceedings Paper
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dc.contributor.authorDubey, Vikas
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorO'Callaghan, John
dc.contributor.authorWillems, Kherim
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorO'Callaghan, John
dc.contributor.imecauthorWillems, Kherim
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecWillems, Kherim::0000-0003-1341-1581
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T10:42:21Z
dc.date.available2021-10-23T10:42:21Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26586
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764501
dc.source.beginpage1
dc.source.conference6th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.source.endpage4
dc.title

Liquid mediated direct bonding and bond propagation

dc.typeProceedings paper
dspace.entity.typePublication
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