Publication:
Impact of Sub-µm Wafer Thinning on Latch-Up Risk in DTCO/STCO Scaling Era
| dc.contributor.author | Serbulova, Kateryna | |
| dc.contributor.author | Chen, Shih-Hung | |
| dc.contributor.author | Hellings, Geert | |
| dc.contributor.author | Veloso, Anabela | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | De Boeck, Jo | |
| dc.contributor.author | Groeseneken, Guido | |
| dc.contributor.imecauthor | Serbulova, Kateryna | |
| dc.contributor.imecauthor | Chen, Shih-Hung | |
| dc.contributor.imecauthor | Hellings, Geert | |
| dc.contributor.imecauthor | Veloso, Anabela | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Groeseneken, Guido | |
| dc.contributor.imecauthor | De Boeck, Jo | |
| dc.contributor.orcidimec | Serbulova, Kateryna::0000-0001-7326-9949 | |
| dc.contributor.orcidimec | Chen, Shih-Hung::0000-0002-6481-2951 | |
| dc.contributor.orcidimec | Hellings, Geert::0000-0002-5376-2119 | |
| dc.contributor.orcidimec | Jourdain, Anne::0000-0002-7610-0513 | |
| dc.contributor.orcidimec | Groeseneken, Guido::0000-0003-3763-2098 | |
| dc.contributor.orcidimec | De Boeck, Jo::0000-0001-8244-1552 | |
| dc.date.accessioned | 2024-09-25T10:05:07Z | |
| dc.date.available | 2024-03-25T17:22:01Z | |
| dc.date.available | 2024-09-25T10:05:07Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/TED.2024.3367315 | |
| dc.identifier.issn | 0018-9383 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43728 | |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
| dc.source.beginpage | 2278 | |
| dc.source.endpage | 2283 | |
| dc.source.issue | 4 | |
| dc.source.journal | IEEE TRANSACTIONS ON ELECTRON DEVICES | |
| dc.source.numberofpages | 6 | |
| dc.source.volume | 71 | |
| dc.title | Impact of Sub-µm Wafer Thinning on Latch-Up Risk in DTCO/STCO Scaling Era | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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