Publication:

Methodologies to mitigate package induced stresses in the BEOL

Date

2016
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorGonzalez, Mario
dc.contributor.authorKljucar, Luka
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T10:58:14Z
dc.date.available2021-10-23T10:58:14Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26654
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764490
dc.source.beginpage1
dc.source.conferenceElectronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.source.endpage7
dc.title

Methodologies to mitigate package induced stresses in the BEOL

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions