Publication:

FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers

Date

Loading...
Thumbnail Image

Abstract

Description

Statistics

Views

2043 since deposited on 2021-10-27
Acq. date: 2026-01-26

Citations

Statistics

Views

2043 since deposited on 2021-10-27
Acq. date: 2026-01-26

Citations