Void growth modeling upon electromigration stressing in single damascene cu lines

dc.contributor.author	Tio Castro, David
dc.contributor.author	Hoofman, Romano
dc.contributor.author	Michelon, Julien
dc.contributor.author	Bruynseraede, Christophe
dc.contributor.imecauthor	Hoofman, Romano
dc.contributor.orcidimec	Hoofman, Romano::0000-0001-8740-104X
dc.date.accessioned	2021-10-16T20:10:19Z
dc.date.available	2021-10-16T20:10:19Z
dc.date.issued	2007
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/12975
dc.identifier.url	http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JAPIAU000102000012123515000001&idtype=cvips&gifs=yes
dc.source.beginpage	123515
dc.source.issue	12
dc.source.journal	Journal of Applied Physics
dc.source.volume	102
dc.title	Void growth modeling upon electromigration stressing in single damascene cu lines
dc.type	Journal article
dspace.entity.type	Publication
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