Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Thermal experimental and modeling analysis of high power 3D packages
Publication:
Thermal experimental and modeling analysis of high power 3D packages
Date
2015-06
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Maggioni, Federica
;
De Vos, Joeri
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1842
since deposited on 2021-10-22
Acq. date: 2025-10-25
Citations
Metrics
Views
1842
since deposited on 2021-10-22
Acq. date: 2025-10-25
Citations