Publication:
Process and material requirements for successful heterogonous passive component integration in RF system
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | De Raedt, Walter | |
| dc.contributor.author | Carchon, Geert | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | De Raedt, Walter | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.date.accessioned | 2021-10-16T15:05:21Z | |
| dc.date.available | 2021-10-16T15:05:21Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11739 | |
| dc.source.beginpage | 13 | |
| dc.source.conference | Advanced Electronic Packaging | |
| dc.source.conferencedate | 27/11/2006 | |
| dc.source.conferencelocation | Boston, MA USA | |
| dc.source.endpage | 22 | |
| dc.title | Process and material requirements for successful heterogonous passive component integration in RF system | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |