Publication:

Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology

Date

2025
Proceedings Paper
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dc.contributor.authorChen, Yukai
dc.contributor.authorMishra, Subrat
dc.contributor.authorRyckaert, Julien
dc.contributor.authorBiswas, Dwaipayan
dc.contributor.authorMyers, James
dc.contributor.imecauthorChen, Yukai
dc.contributor.imecauthorMishra, Subrat
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorBiswas, Dwaipayan
dc.contributor.imecauthorMyers, James
dc.contributor.orcidimecChen, Yukai::0000-0003-3378-887X
dc.contributor.orcidimecMishra, Subrat::0000-0002-1435-3275
dc.contributor.orcidimecBiswas, Dwaipayan::0000-0002-1087-3433
dc.date.accessioned2025-08-03T03:58:24Z
dc.date.available2025-08-03T03:58:24Z
dc.date.issued2025
dc.identifier.eisbn978-3-9826741-0-0
dc.identifier.issn1530-1591
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/46020
dc.publisherIEEE
dc.source.conference2025 Design, Automation & Test in Europe Conference-DATE
dc.source.conferencedateMAR 31-APR 02, 2025
dc.source.conferencelocationLyon
dc.source.numberofpages2
dc.title

Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology

dc.typeProceedings paper
dspace.entity.typePublication
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