Publication:

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects

Date

2016
Meeting abstract
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dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorDictus, Dries
dc.contributor.authorTanaka, Tetsu
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.date.accessioned2021-10-23T16:01:01Z
dc.date.available2021-10-23T16:01:01Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27450
dc.source.beginpageMT1
dc.source.conference25th Advanced Materials for Metalization Conference - MAM
dc.source.conferencedate21/03/2016
dc.source.conferencelocationBrussel Belgium
dc.title

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects

dc.typeMeeting abstract
dspace.entity.typePublication
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