Publication:

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP

Date

2022-06-15
Proceedings Paper
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dc.contributor.authorMurdoch, Gayle
dc.contributor.authorO'Toole, Martin
dc.contributor.authorMarti, Giulio
dc.contributor.authorPokhrel, Ankit
dc.contributor.authorTsvetanova, Diana
dc.contributor.authorDecoster, Stefan
dc.contributor.authorKundu, Souvik
dc.contributor.authorOniki, Yusuke
dc.contributor.authorThiam, Arame
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorMartinez Alanis, Gerardo Tadeo
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorO'Toole, Martin
dc.contributor.imecauthorMarti, Giulio
dc.contributor.imecauthorPokhrel, Ankit
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorKundu, Souvik
dc.contributor.imecauthorOniki, Yusuke
dc.contributor.imecauthorThiam, Arame
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorMartinez Alanis, Gerardo Tadeo
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecTsvetanova, Diana::0000-0002-5632-5539
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecOniki, Yusuke::0000-0002-6619-1327
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecMartinez Alanis, Gerardo Tadeo::0000-0001-5036-0491
dc.contributor.orcidimecMurdoch, Gayle:::0000-0002-6833-220X
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2024-01-25T11:57:39Z
dc.date.available2023-06-26T10:41:05Z
dc.date.available2024-01-25T11:57:39Z
dc.date.embargo2022-06-30
dc.date.issued2022-06-15
dc.identifier.issn2158-9682
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42096
dc.source.conferenceVLSI Technology and Circuits
dc.source.conferencedate12-17 June 2022
dc.source.conferencelocationHonolulu, Hawaii
dc.source.journal2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
dc.source.numberofpages2
dc.subject.disciplineElectrical & electronic engineering
dc.subject.keywordsInterconnect, Ruthenium, semi-damascene, fully self-aligned via
dc.title

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP

dc.typeProceedings paper
dspace.entity.typePublication
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