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Integration of non-etchback low-k methy silsequioxane polymer using electron beam cure
Publication:
Integration of non-etchback low-k methy silsequioxane polymer using electron beam cure
Date
1999
Proceedings Paper
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3420.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gao, Teng
;
Coenegrachts, Bart
;
Waeterloos, Joost
;
Van Hove, Marleen
;
Maex, Karen
;
Yang, Jiping
;
Wang, Sharon
;
Forester, Lynn
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1943
since deposited on 2021-10-06
Acq. date: 2025-10-23
Citations
Metrics
Views
1943
since deposited on 2021-10-06
Acq. date: 2025-10-23
Citations