Publication:

Improved thermal dissipation in InP wire photonic crystal laser on silicon by addition of diamond nanoparticles in polymer bonding layer

Date

2010
Proceedings Paper
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dc.contributor.authorBazin, A.
dc.contributor.authorHalioua, Y.
dc.contributor.authorMonnier, P.
dc.contributor.authorBordas, F.
dc.contributor.authorKarle, T.J.
dc.contributor.authorPerruchas, S.
dc.contributor.authorGacoin, T.
dc.contributor.authorGirard, H.
dc.contributor.authorSagnes, I.
dc.contributor.authorRaj, R.
dc.contributor.authorRaineri, F.
dc.date.accessioned2021-10-18T15:18:54Z
dc.date.available2021-10-18T15:18:54Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16718
dc.source.conferenceEOS Annual Meeting - EOSAM
dc.source.conferencedate26/10/2010
dc.source.conferencelocationParis France
dc.title

Improved thermal dissipation in InP wire photonic crystal laser on silicon by addition of diamond nanoparticles in polymer bonding layer

dc.typeProceedings paper
dspace.entity.typePublication
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