Publication:
Interconnect materials challenges for sub 20 nm technology nodes: ultra low-k dielectrics
Date
| dc.contributor.author | Baklanov, Mikhaïl | |
| dc.date.accessioned | 2021-10-20T10:04:18Z | |
| dc.date.available | 2021-10-20T10:04:18Z | |
| dc.date.issued | 2012 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20337 | |
| dc.source.conference | IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - ICSICT | |
| dc.source.conferencedate | 29/10/2012 | |
| dc.source.conferencelocation | Xi'an China | |
| dc.title | Interconnect materials challenges for sub 20 nm technology nodes: ultra low-k dielectrics | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
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