Publication:

Thickness and temperature dependent resistivity of thin copper films

Date

2004
Proceedings Paper
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dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorClarysse, Trudo
dc.contributor.authorWu, Wen
dc.contributor.authorVervoort, Iwan
dc.contributor.authorPalmans, Roger
dc.contributor.authorHoflijk, Ilse
dc.contributor.authorBender, Hugo
dc.contributor.authorHui, W.
dc.contributor.authorCarbonell, Laure
dc.contributor.authorRosseel, Erik
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorHoflijk, Ilse
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-15T18:14:17Z
dc.date.available2021-10-15T18:14:17Z
dc.date.embargo9999-12-31
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9974
dc.source.beginpage219
dc.source.conferenceAdvanced Metallization Conference 2003
dc.source.conferencedate21/10/2003
dc.source.conferencelocationMontreal/Tokyo
dc.source.endpage224
dc.title

Thickness and temperature dependent resistivity of thin copper films

dc.typeProceedings paper
dspace.entity.typePublication
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