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Metallization of 3D via structures in silicon for interconnect technology
Publication:
Metallization of 3D via structures in silicon for interconnect technology
Date
2008
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Luhn, Ole
;
Van Hoof, Chris
;
Ruythooren, Wouter
;
Celis, Jean-Pierre
Journal
Abstract
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1869
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
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Views
1869
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations