Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Key challenges and opportunities for 3D sequential integration
Publication:
Key challenges and opportunities for 3D sequential integration
Copy permalink
Date
2018-10
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
40283.pdf
282.97 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandooren, Anne
;
Witters, Liesbeth
;
Franco, Jacopo
;
Mallik, Arindam
;
Parvais, Bertrand
;
Wu, Zhicheng
;
Li, Waikin
;
Rosseel, Erik
;
Hikavyy, Andriy
;
Peng, Lan
;
Rassoul, Nouredine
;
Jamieson, Geraldine
;
Inoue, Fumihiro
;
Verbinnen, Greet
;
Devriendt, Katia
;
Teugels, Lieve
;
Heylen, Nancy
;
Vecchio, Emma
;
Tao, Zheng
;
Waldron, Niamh
;
Boemmels, Juergen
;
De Heyn, Vincent
;
Mocuta, Dan
;
Ryckaert, Julien
;
Collaert, Nadine
Journal
Abstract
Description
Metrics
Downloads
1
since deposited on 2021-10-26
Acq. date: 2025-12-15
Views
2030
since deposited on 2021-10-26
2
last month
Acq. date: 2025-12-15
Citations
Metrics
Downloads
1
since deposited on 2021-10-26
Acq. date: 2025-12-15
Views
2030
since deposited on 2021-10-26
2
last month
Acq. date: 2025-12-15
Citations