Publication:
Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart II
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-5058-8303 | |
| cris.virtualsource.department | 8a303854-e9b4-460a-b79d-03df3b3c4394 | |
| cris.virtualsource.orcid | 8a303854-e9b4-460a-b79d-03df3b3c4394 | |
| dc.contributor.author | Hao, Qin-Fen | |
| dc.contributor.author | Chen, Kuan-Neng | |
| dc.contributor.author | Goel, Sandeep Kumar | |
| dc.contributor.author | Li, Hai | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.date.accessioned | 2026-04-27T13:49:04Z | |
| dc.date.available | 2026-04-27T13:49:04Z | |
| dc.date.createdwos | 2026-01-03 | |
| dc.date.issued | 2025 | |
| dc.identifier.doi | 10.1109/jetcas.2025.3637354 | |
| dc.identifier.eissn | 2156-3365 | |
| dc.identifier.issn | 2156-3357 | |
| dc.identifier.issn | 2156-3365 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/59216 | |
| dc.language.iso | eng | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
| dc.source.beginpage | 509 | |
| dc.source.endpage | 513 | |
| dc.source.issue | 4 | |
| dc.source.journal | IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS | |
| dc.source.numberofpages | 5 | |
| dc.source.volume | 15 | |
| dc.title | Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart II | |
| dc.type | Editorial material | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2025-12-24 | |
| imec.internal.source | crawler | |
| imec.internal.wosCreatedAt | 2026-04-07 | |
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