Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package

dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Beyne, Eric
dc.contributor.author	Van Puymbroeck, Jan
dc.contributor.author	Heerman, M.
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.imecauthor	Van Puymbroeck, Jan
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-14T11:51:23Z
dc.date.available	2021-10-14T11:51:23Z
dc.date.embargo	9999-12-31
dc.date.issued	1999
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/3968
dc.source.beginpage	392
dc.source.conference	Proceedings of the 12th European Microelectronics and Packaging Conference
dc.source.conferencedate	7/06/1999
dc.source.conferencelocation	Harrogate UK
dc.source.endpage	398
dc.title	Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package
dc.type	Proceedings paper
dspace.entity.type	Publication
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