UTCS: ultra thin chip stacking a WSI emulation technology

dc.contributor.author	Coello-Vera, A.
dc.contributor.author	Vendier, O.
dc.contributor.author	Beyne, Eric
dc.contributor.author	Van Hoof, Rita
dc.contributor.author	Pinel,
dc.contributor.author	Bailbé, J.P.
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.imecauthor	Van Hoof, Rita
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-14T14:26:59Z
dc.date.available	2021-10-14T14:26:59Z
dc.date.issued	2000
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/4985
dc.source.beginpage	81
dc.source.conference	3rd Round Table on Micro/Nano-Technologies for Space
dc.source.conferencedate	15/05/2000
dc.source.conferencelocation	Noordwijk The Netherlands
dc.source.endpage	84
dc.title	UTCS: ultra thin chip stacking a WSI emulation technology
dc.type	Proceedings paper
dspace.entity.type	Publication
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