Publication:

Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms

Date

2015
Proceedings Paper
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dc.contributor.authorHalder, Sandip
dc.contributor.authorTruffert, Vincent
dc.contributor.authorVan Den Heuvel, Dieter
dc.contributor.authorLeray, Philippe
dc.contributor.authorCheng, Shaunee
dc.contributor.authorMcIntyre, Greg
dc.contributor.authorSah, Kaushik
dc.contributor.authorBrown, Jim
dc.contributor.authorParisi, Paolo
dc.contributor.authorPolli, Marco
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorVan Den Heuvel, Dieter
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorSah, Kaushik
dc.contributor.imecauthorParisi, Paolo
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.date.accessioned2021-10-22T19:35:38Z
dc.date.available2021-10-22T19:35:38Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25357
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7164444
dc.source.beginpage19
dc.source.conference26th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate3/05/2015
dc.source.conferencelocationSaratoga Springs, NY USA
dc.source.endpage22
dc.title

Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms

dc.typeProceedings paper
dspace.entity.typePublication
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