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Conference contributions
Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies
Publication:
Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies
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Date
2014
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29065.pdf
1.34 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanfleteren, Jan
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Abstract
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1819
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Acq. date: 2025-12-15
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Views
1819
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-15
Citations