Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias
Publication:
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias
Copy permalink
Date
2014
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Van Huylenbroeck, Stefaan
;
Van Besien, Els
;
Shi, Xiaoping
;
Wu, Chen
;
Stucchi, Michele
;
Beyer, Gerald
;
Beyne, Eric
;
De Wolf, Ingrid
;
Croes, Kristof
Journal
Microelectronics Reliability
Abstract
Description
Metrics
Views
1812
since deposited on 2021-10-22
Acq. date: 2026-01-11
Citations
Metrics
Views
1812
since deposited on 2021-10-22
Acq. date: 2026-01-11
Citations