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Small pitch micro-bumping and experimental investigation for under filling 3D stacking

Date

2012-09
Proceedings Paper
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dc.contributor.authorLa Manna, Antonio
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorGerets, Carine
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T12:28:54Z
dc.date.available2021-10-20T12:28:54Z
dc.date.embargo9999-12-31
dc.date.issued2012-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20974
dc.source.beginpage535
dc.source.conferenceIMAPS 45th International Symposium on Microelectronics
dc.source.conferencedate9/09/2012
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage541
dc.title

Small pitch micro-bumping and experimental investigation for under filling 3D stacking

dc.typeProceedings paper
dspace.entity.typePublication
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